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Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP V191 18.5-inch LED Backlit LCD Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a
surface greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB/PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in diameter
or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants weighing > 25 grams (not
including PCBs or PCAs already listed as a
separate item above)
Components and parts containing toner
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and
lithium coin or button style batteries
For example, mercury in lamps, display
backlights, scanner lamps, switches,
batteries
Includes background illuminated displays
with gas discharge lamps
Include the cartridges, print heads, tubes,
PSG instructions for this template are available at
Quantity of items included
in product
3
0
0
1
0
0
2
LV1911 V191 : 2
W1971a/W1972a/W1952a:3
0
0
0
EL-MF877-01
Page 1
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Summary of Contents for HP V191
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 and ink, including liquids, semi-liquids vent chambers, and service stations. (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
- Page 3 HP 185 Disassembly Process...
- Page 4 External Electric Cables Dissecting Process AUDIO Cable Power Cable D-SUB &DVI Cable 1.Remove Cable From Display Head. 2.Dissecting to Complete.
- Page 5 Remove Stand Base From Display 1.Take Screw(*5) from Rear Cover. 2. Demount Stand & Remove Stand Base Form Display.
- Page 6 Remove Rear Cover From Display Head 2.Turn over Display Head. 1.Both Hands Upwardly Pull Up. 3. Toward the arrowhead , take the 4. Remove Rear Cover. Rear Cover from the Front Cover.
- Page 7 Remove KEPC board From Front Cover 2.Remove Connector off from KEPC board 1. Take the KEPC assembly from the Front and disassemble KEPC assembly . Cover.
- Page 8 Remove Mainframe &Panel 1. Remove Connector off from Power 2.Remove the Conductive Tape from board & Panel. the Mainframe. 4.Remove the connecting wire 3.Remove Mainframe & Panel.
- Page 9 Remove Front Cover &Panel 1.Turn over Panel, and remove the Front 2. Dissecting to complete. Cover off from Panel. Direct at the LNT panel Modle 3. Demount BRACKET-L & BRACKET-R Form LNT panel.
- Page 10 Take Screw off From Mainframe Assembly 1.Take Screw(*4 or 2) from Mainframe. 2.Tear off Mylar form mainframe 3. Take Screw(*6) from Power Bd & Main Bd .
- Page 11 Remove Mainframe & Barod 1. Direct at the Modle have Audio function: Remove the Audio Connector off from Power Bd . 2.Remove the Power Bd & Main Bd off 3.Remove the connecting wire off from from Mainframe. Power Bd & Main Bd .
- Page 12 Remove Audio & Mainframe Direct at the Modle have Audio function: 1. Take Mainframe, remove the Audio 2. Dissecting to complete. off from Mainframe.
- Page 13 Remove Stand & Base 1.Take Stand assembly. 3. Remove the Stand off from the 2. Pinch the limit RIB of Base. Base.
- Page 14 Remove hinge & stand 1. Take screw(*2) off, and remove the Hinge 2. Dissecting to complete. off from the Stand.
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Page 15: Thank You
Thank You...