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Reflow Soldering; Optical Inspection; Repeated Reflow Soldering; Wave Soldering - Ublox AMY-6M Hardware Integration Manual

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3.3.2 Reflow soldering

Preheat/ Soak Temperature min.
Preheat/ Soak Temperature max.
Preheat/ Soak Time from T
smin
Liquidus Temperature
Time maintained above T
L
Peak Package Body Temperature
Ramp up rate (T
to T
)
L
P
Time within +0°C...-5°C of T
Ramp down rate (T
to T
)
P
L
Table 11: Recommended conditions for reflow process
The peak temperature must not exceed 250°C. The time above 245°C must not exceed 30 seconds.
AMY-6M must not be soldered with a damp heat process.

3.3.3 Optical inspection

After soldering the AMY-6M module, consider an optical inspection step to check whether:
The module is properly aligned and centered over the pads

3.3.4 Repeated reflow soldering

Only single reflow soldering processes are recommended for boards populated with AMY-6M modules.

3.3.5 Wave soldering

Base boards with combined through-hole technology (THT) components and surface-mount technology (SMT)
devices require wave soldering to solder the THT components. Only a single wave soldering process is
encouraged for boards populated with AMY-6M.

3.3.6 Rework

Not recommended.

3.3.7 Conformal coating

Certain applications employ a conformal coating of the PCB using HumiSeal
Conformal Coating of the module will void the warranty.

3.3.8 Casting

If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such
processes in combination with the u-blox 6 module before implementing this in the production.
Casting will void the warranty.

3.3.9 Use of ultrasonic processes

Some components on the u-blox 6 module are sensitive to Ultrasonic Waves. Use of any Ultrasonic Processes
(cleaning, welding etc.) may cause damage to the GPS Receiver.
u-blox offers no warranty against damages to the u-blox 6 module caused by any Ultrasonic Processes.
UBX-17021971 – R07
T
smin
T
smax
to T
T
(T
to T
smax
s
smin
T
L
t
L
T
P
P
)
smax
AMY-6M - Hardware Integration Manual
150°C
180°C
< 90 seconds
217°C
40 to 60 seconds
250°C
3°C/ second max.
30 seconds
4°C/ second max.
®
or other related coating products.
Product handling & soldering
Page 42 of 57

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