Safety Precautions; Prevention Of Electrostatic Discharge (Esd) To Electrostatically Sensitive (Es) Devices - Panasonic TX-32LXD60 Service Manual
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COLD
WATER PIPE
(EARTH GROUND)
TO
APPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms (Ω)
V:
Voltmetr or oscilloscope
(r.m.s. or peak reading)
NOTE – Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms
PREVENTION OF ELECTROSTATIC DISCHARGE (ESD) TO
ELECTROSTATICALLY SENSITIVE (ES) DEVICES
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect
transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence
of component damage caused by electrostatic discharge (ESD).
1.
Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD
on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2.
After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge build up or exposure of the assembly.
3.
Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.
Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD
protected)" can generate electrical charge sufficient to damage ES devices.
5.
Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.
Do not remove a replacement ES device from its protective package until immediately before you are ready to install
it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum
foil or comparable conductive material).
7.
Immediately before removing the protective material from the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.
Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static
electricity (ESD) sufficient to damage an ES device).
There are special components used in this equipment which are important for safety.
These parts are marked by
these critical parts should be replaced with manufacturer's specified parts to prevent shock, fire, or other hazards. Do
not modify the original design without permission of manufacturer.
All manuals and user guides at all-guides.com
Measuring network for TOUCH CURRENTS
R
=500Ω
S
R
=500Ω
0
Input resistance: ≥ 1MΩ
Input capacitance: ≤ 200pF
Frequency range: 15Hz to 1Mhz and d.c.respectively
Fig. 2
IMPORTANT SAFETY
in schematic diagrams, exploded views and replacement parts list. It is essential that
3
C
=500µF
S
10kΩ
U
0.022µF
1
V
U
(V)
2
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