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Sony HCD-DX30/RG40 Service Manual
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Sony HCD-DX30/RG40 Service Manual

Compact disc deck receiver
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SERVICE MANUAL
Ver 1.2 2003. 11
• HCD-DX30/RG40 are the tuner,
deck, CD and amplifier section in
MHC-DX30/RG40.
AUDIO POWER SPECIFICATIONS:
(HCD-RG40 USA models only)
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
with 6 ohm loads both channels driven, from
120 – 10,000 Hz; rates 100 watts per channel
minimum RMS power, with no more than 10%
total harmonic distortion from 250 milliwatts to
rated output.
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 50 W)
Amplifier section
US, Canadian models:
HCD-RG40
Continuous RMS power output (reference)
100 + 100 watts (6 ohms
at 1 kHz, 10% THD)
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 50 W)
AEP models:
HCD-RG40
DIN power output (rated) 65 + 65 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
80 + 80 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference)
160 + 160 watts (6 ohms
at 1 kHz, 10% THD)
Sony Corporation
9-873-149-03
2003K16-1
Home Audio Company
© 2003.11
Published by Sony Engineering Corporation
HCD-DX30/RG40
Photo : HCD-DX30
CD
Section
Tape deck
Section
SPECIFICATIONS
Other models:
HCD-DX30
The following measured at AC 120, 220, 240 V
50/60 Hz
DIN power output (rated) 100 + 100 watts
Continuous RMS power output (reference)
Inputs
MD/VIDEO (AUDIO) IN (phono jacks):
GAME (AUDIO) IN (phono jack):
MIC (mini jack):
Outputs
PHONES (stereo mini jack):
FRONT SPEAKER:
SURROUND SPEAKER (MHC-RG60 only):
Model Name Using Similar Mechanism
CD Mechanism Type
Base Unit Name
Optical Pick-up Name
Model Name Using Similar Mechanism
CD player section
System
Laser
(6 ohms at 1 kHz, DIN)
Laser output
120 + 120 watts (6 ohms
at 1 kHz, 10% THD)
voltage 450/250 mV,
impedance 47 kilohms
Frequency response
voltage 450 mV,
Wavelength
impedance 47 kilohms
Signal-to-noise ratio
sensitivity 1 mV,
Dynamic range
impedance 10 kilohms
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
accepts headphones of
Output Level
8 ohms or more
accepts impedance of 6 to
16 ohms
accepts impedance of 6 to
16 ohms
COMPACT DISC DECK RECEIVER
US Model
Canadian Model
AEP Model
HCD-RG40
E Model
Australian Model
HCD-DX30
NEW
CDM58B-K6BD38
BU-K2BD38
KSM-213D
NEW
Compact disc and digital
audio system
Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
Max. 44.6 µW*
*This output is the value
measured at a distance of
200 mm from the
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture.
2 Hz – 20 kHz (±0.5 dB)
780 – 790 nm
More than 90 dB
More than 90 dB
660 nm
–18 dBm
— Continued on next page —

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  • Page 1 US Model Canadian Model Ver 1.2 2003. 11 AEP Model HCD-RG40 E Model Australian Model HCD-DX30 • HCD-DX30/RG40 are the tuner, deck, CD and amplifier section in Photo : HCD-DX30 MHC-DX30/RG40. Model Name Using Similar Mechanism CD Mechanism Type CDM58B-K6BD38 Section...
  • Page 2 CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU PUBLISHED BY SONY.

  • Page 3: Table Of Contents

    HCD-DX30/RG40 Ver 1.1 2002.05 TABLE OF CONTENTS NOTES ON HANDLING THE OPTICAL PICK-UP 1. SERVICE NOTE ······························································· 4 BLOCK OR BASE UNIT 2. GENERAL ·········································································· 5 The laser diode in the optical pick-up block may suffer electrostatic 3. DISASSEMBLY ································································ 7 break-down because of the potential difference generated by the 4.

  • Page 4: Service Note

    HCD-DX30/RG40 SECTION 1 SERVICE NOTE REMOVING THE PANEL BOARD AND THE KEY BOARD * The panel board and the key board only are connected to the front panel by means of hot-melting the plastics. 5 Key board 3 Panel board...

  • Page 5: General

    HCD-DX30/RG40 SECTION 2 GENERAL This section is extracted from instruction manual. Main unit 1 2 3 4 8 9 q; AUDIO jacks ed MD (VIDEO) qg BUTTON DESCRIPTIONS CD qs MIC jack* CD SYNC wf MIC LEVEL control* v/V/b/B 5...
  • Page 6 HCD-DX30/RG40 Remote Control 1 2 3 4 CD qj MD (VIDEO) 9 BUTTON DESCRIPTIONS CLEAR 6 P FILE qd CLOCK/TIMER SELECT 2 PRESET EQ qg v/V/b/B qs CLOCK/TIMER SET 3 SLEEP 1 M (fast forward)/TUNING D.SKIP ql SURROUND 0 EFFECT ON/OFF qa TAPE A/B 8 .

  • Page 7: Disassembly

    HCD-DX30/RG40 SECTION 3 DISASSEMBLY Note : Disassemble the unit in the order as shown below. Case (Top) CD door Front panel section Base unit Driver board, Moter board and Address sensor board Tape mechanism deck Panel board Key board Sub trans board, Trans board, Sensor board and Video out board Main board and Power board Note : Follow the disassembly procedure in the numerical order given.
  • Page 8 HCD-DX30/RG40 3-2. CD DDOR CD door CD mechanism deck (CDM58B) 1 Turn the pulley to the direction of arrow. Front panel side pulley 2 Pull-out the disc tray. 3-3. FRONT PANEL SECTION 7 Connector 2p (CN714) CD mechanism deck (CDM58B)
  • Page 9 HCD-DX30/RG40 3-4. TAPE MECHANISM DECK 1 Six screws (+BVTP 2.6 × 8) 2 Tape mechanism deck 3-5. PANEL BOARD 6 Panel board 4 Connector 13p (CN712) 2 Vol knob ring 5 Cut the seven melted-connection points with a cutting plier.
  • Page 10 HCD-DX30/RG40 3-6. KEY BOARD 2 Key board 1 Cut the six melted-connection points with a cutting plier. Note: When attching the Key board, refer to "Service Note" on page 4. 3-7. SUB TRANS BOARD, TRANS BOARD, SENSOR BOARD AND VIDEO OUT BOARD...
  • Page 11 HCD-DX30/RG40 3-8. MAIN BOARD AND POWER BOARD 7 Heat sink 6 Two screws (+BVTT 3 × 6) 4 Three screws (+BVTT 3 × 6) Main board 5 Power board 3 Two screws (+BVTP 3 × 16) 2 Main board 1 Two screws (+BVTT 3 × 6) 3-9.
  • Page 12 HCD-DX30/RG40 3-10. DRIVER BOARD, MOTOR BOARD AND ADDRESS SENSOR BOARD q; Screw (+PTPWH 2.6 × 8) 4 Two screws (+BVTP 2.6 × 8) 8 Motor board 6 Wire (flat type) 8p (CN721) 5 Remove the two solderings of motor. qs Screw (+BVTP 2.6 × 8)

  • Page 13: Test Mode

    HCD-DX30/RG40 SECTION 4 TEST MODE [MC Cold Reset] [Change-over of AM Tuner Step between 9 kHz and • The cold reset clears all data including preset data stored in the 10 kHz] RAM to initial conditions. Execute this mode when returning •...
  • Page 14 HCD-DX30/RG40 [MC Test Mode] [Microprocessor version display] • This mode is used to check operations of the respective sections • If the following operation is performed during the POWER OFF of Amplifier, TUNER, CD and Tape. in the modes other than the POWER SAVE mode (i.e., while the...
  • Page 15 HCD-DX30/RG40 [Aging Mode] This mode can be used for operation check of CD section and tape deck section. • If an error occurred: The aging operation stops and display status. • If no error occurs: The aging operation continues repeatedly.
  • Page 16 HCD-DX30/RG40 2) Operation during aging mode In the aging mode, the program is executed in the following sequence. (1) The disc tray opens and closes. (2) The mechanism accesses DISC 2 and makes an attempt to read TOC. However, since there are no discs, a message “CD2 NO DISC”...

  • Page 17: Electrical Adjustments

    HCD-DX30/RG40 SECTION 5 ELECTRICAL ADJUSTMENTS FM Tuned Level Adjustment CD SECTION FM RF Signalgenerator Note : 1. CD Block is basically designed to operate without adjustment. 75 Ω coaxial Therefore, check each item in order given. 2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
  • Page 18 HCD-DX30/RG40 Note : Clear RF signal waveform means that the shape “ ◊ ” can be clearly Adjustment Location: distinguished at the center of the waveform. [BD BOARD] (Conductor Side) RF signal waveform VOLT/DIV : 200mV TIME/DIV : 500ns level : 1.45 ± 0.3Vp-p...

  • Page 19: Diagrams

    HCD-DX30/RG40 SECTION 6 DIAGRAMS THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) Note on Schematic Diagram: Note on Printed Wiring Boards: • All capacitors are in µF unless otherwise noted. pF: µµF •...

  • Page 20: Circuit Board Location

    HCD-DX30/RG40 6-1. CIRCUIT BOARD LOCATION MOTOR board ADDRESS SENSOR board VIDEO OUT board DRIVER board BD board SUB TRANS board TRANS board SENSOR board PANEL board MAIN board KEY board POWER AMP board • WAVEFORMS – BD BOARD – – MAIN BOARD –...

  • Page 21: Block Diagrams Tuner/Cd Section

    HCD-DX30/RG40 Ver 1.2 2003.11 6-2. BLOCK DIAGRAMS TUNER/CD SECTION EXCEPT US,CND,AEP MODEL AM/FM IF MPX TM101 FE101 Q101 IC101 CF101 CF102 RF IF BUFFER L-CH • R-CH is omitted due to same as L-CH. ANT IN IF OUT FM IF...

  • Page 22: Main Section

    HCD-DX30/RG40 MAIN SECTION INPUT SELECT TONE/VOL CONT IC301 CN301 • RCH is omitted IC501 TUNER L-CH TUNER/L • Signal Path SECTION OUT L POWER Q365 Q363 SPEAKER Q381,382 RY371 MUTE Q384,385 : PB (DECK A) OUT R R-CH MUTE R CH...

  • Page 23: Schematic Diagram Main Section (1/4)

    HCD-DX30/RG40 6-3. SCHEMATIC DIAGRAM MAIN SECTION (1/4) • See page 20 for Wavefoms. • See page 42 for IC Block Diagrams. DX30 (Page 24) IC B/D IC B/D (Page 25)

  • Page 24: Schematic Diagram Main Section (2/4)

    HCD-DX30/RG40 6-4. SCHEMATIC DIAGRAM MAIN SECTION (2/4) • See page 43 for IC Block Diagrams. IC B/D (Page 23) (Page 25) (Page 26)

  • Page 25: Schematic Diagram Main Section (3/4)

    HCD-DX30/RG40 6-5. SCHEMATIC DIAGRAM MAIN SECTION (3/4) (Page 23) (Page 24) (Page 26) (Page 31)

  • Page 26: Schematic Diagram Main Section (4/4)

    HCD-DX30/RG40 6-6. SCHEMATIC DIAGRAM MAIN SECTION (4/4) • See page 20 for Wavefoms. • See page 40 for IC Pin Function Description. (Page 24) (Page 33) (Page 25) (Page 37) (Page 29) (Page 31)

  • Page 27: Printed Wiring Board Main Section

    HCD-DX30/RG40 6-7. PRINTED WIRING BOARD MAIN SECTION • See page 20 for Circuit Boards Location. • Semiconductor Location Ref. No. Location Ref. No. Location MAIN BOARD D101 D-13 Q101 C-11 DRIVER BD BOARD BOARD CN101 D104 C-11 Q102 A-12 CN701...

  • Page 28: Printed Wiring Board Bd Section

    HCD-DX30/RG40 Ver 1.2 2003.11 6-8. PRINTED WIRING BOARD BD SECTION • Semiconductor Location Ref. No. Location IC101 IC102 IC103 Q101 TP(TE0) (VC) TP(FE0) (RF) TP(FE1) TP(AGC CON) TP(D GND) (XPCK) CN102 (Page 27)

  • Page 29: Schematic Diagram Bd Section

    HCD-DX30/RG40 Ver 1.2 2003.11 6-9. SCHEMATIC DIAGRAM BD SECTION • See page 20 for Wavefoms. • See page 43, 44 for IC Block Diagrams. IC B/D IC B/D IC B/D (4/4) CN102 (Page 26)

  • Page 30: Printed Wiring Board Power Amp Section

    HCD-DX30/RG40 6-10. PRINTED WIRING BOARD POWER AMP SECTION • See page 20 for Circuit Boards Location. • Semiconductor SENSOR BOARD POWER AMP BOARD IC501 Location Ref. No. Location D501 D502 AEP,KR D541 D542 D543 D551 (11) IC501 Q501 Q503 Q504...

  • Page 31: Schematic Diagram Power Amp Section

    HCD-DX30/RG40 6-11. SCHEMATIC DIAGRAM POWER AMP SECTION D5SBA204101 2 : C502,552 470p : RG40 1000p : DX30 DX30 RG40 DX30 3 : R504,554 CN915 AEP,KR 33k : RG40 (Page 39) 56k : DX30 DX30 DX30 AEP,KR Q582,583 OVER HEAT DETECTOR...

  • Page 32: Printed Wiring Board Panel Section

    HCD-DX30/RG40 6-12. PRINTED WIRING BOARD PANEL SECTION • See page 20 for Circuit Boards Location. • Semiconductor PANEL BOARD Location Ref. No. Location (FLUORESCENT INDCATOR TUBE) D701 A-12 D702 SENS701 D703 D704 D705 D706 C-12 DX30 D713 D716 D717 D718...

  • Page 33: Schematic Diagram Panel Section

    HCD-DX30/RG40 6-13. SCHEMATIC DIAGRAM PANEL SECTION • See page 20 for Wavefoms. • See page 41 for IC Pin Function Description. 4 .9 3 .1 (Page 26) (Page 35)

  • Page 34: Printed Wiring Board Key Section

    HCD-DX30/RG40 6-14. PRINTED WIRING BOARD KEY SECTION • See page 20 for Circuit Boards Location. • Semiconductor KEY BOARD Location Ref. No. Location D707 D708 D709 D710 Q707 Q708 Q709 Q710 DX30 (11) 1-681-447- S704-721,726-738 PANEL BOARD CN712 (Page 32)

  • Page 35: Schematic Diagram Key Section

    HCD-DX30/RG40 6-15. SCHEMATIC DIAGRAM KEY SECTION (Page 33)

  • Page 36: Printed Wiring Board Driver Section

    HCD-DX30/RG40 6-16. PRINTED WIRING BOARD DRIVER SECTION • See page 20 for Circuit Boards Location. (Page 27)

  • Page 37: Schematic Diagram Driver Section

    HCD-DX30/RG40 6-17. SCHEMATIC DIAGRAM DRIVER SECTION • See page 43 for IC Block Diagrams. IC B/D (4/4) (Page 26)

  • Page 38: Printed Wiring Board Trans Section

    HCD-DX30/RG40 6-18. PRINTED WIRING BOARD TRANS SECTION • See page 20 for Circuit Boards Location. TRANS BOARD EXCEPT SP,E,AR,E51 POWER TRANSFORMER SP,E,AR,E51 US,CND,MX,KR VOLTAGE SELECTOR MX,KR US,CND,SP,E,AR,E51 POWER AMP BOARD CN501 (Page 30) AEP,SP,E,AR,E51 US,CND SP,E,AR,E51 SP,E,AR,E51,AUS 1-681-444- (11) SUB TRANS BOARD...

  • Page 39: Schematic Diagram Trans Section

    HCD-DX30/RG40 6-19. SCHEMATIC DIAGRAM TRANS SECTION (Page 31)

  • Page 40: Ic Pin Function Description

    HCD-DX30/RG40 6-20. IC PIN FUNCTION DESCRIPTION • MAIN BOARD IC401 M30622MCA-B23FP (MASTER CONTROL) Pin No. Pin Name Description Pin No. Pin Name Description S-OUT Serial data output the display control. NO USE — Not used. S-CLK Serial clock output from main controller.
  • Page 41 HCD-DX30/RG40 • PANEL BOARD IC701 UPD780232GC-031-8BT (DISPLAY CONTROL) Pin No. Pin Name Description — Power supply.(+5V) — Connected to ground. System clock output terminal.(5MHz) System clock input terminal.(5MHz) RESET Reset signal input from main controller. S-CLK Serial clock input from main controller.

  • Page 42: Ic Block Diagrams

    HCD-DX30/RG40 6-21. IC BLOCK DIAGRAMS IC101 BA1450 (MAIN BOARD) AM IF VREG DECODER DRIVER COMP IC102 LC72130 (MAIN BOARD) SWALLOW COUNTER 1/16.1/17 4bits POWER REFERENCE RESET DIVIDER SWALLOW COUNTER 1/16.1/17 4bits REFERENCE DIVIDER PHASE DETECTOR CHARGE PUMP DATA SHIFT REGISTER...
  • Page 43 HCD-DX30/RG40 IC201 TA8189N (MAIN BOARD) IC701 BA6956AN (DRIVER BOARD) METAL TAPE A CH2/A CH2/B /TAPE B – CONTROL LOGIC – VREF1 IREF VREF2 – – CH1/A CH1/B METAL GND1 IC101 CXD2587Q (BD BOARD) ERROR DIGITAL CORRECTOR ASYMMETRY DIGITAL CORRECTION OPERATIONAL...
  • Page 44 HCD-DX30/RG40 IC102 BA5974P (BD BOARD) MUTE INTERFACE LEVEL SHIFT THERMAL SHUTDOWN INTERFACE INTERFACE IC103 CXA2568M-T (BD BOARD) APC PD AMP LC/PD LD_ON HOLD AGCVTH VREF APC LD AMP HOLD_SW AGCCONT (50%/30% OFF) RF_BOT RFTC RF SUMMING AMP RF_EQ_AMP RF_1 ERROR AMP...

  • Page 45: Exploded Views

    HCD-DX30/RG40 Ver 1.1 2002.05 SECTION 7 EXPLODED VIEWS NOTE: • -XX, -X mean standardized parts, so they may • Abbreviation The components identified by mark 0 or have some differences from the original one. CND : Canadian model dotted line with mark 0 are critical for safety.

  • Page 46: Front Panel Section

    HCD-DX30/RG40 7-2. FRONT PANEL SECTION * For service only (Be sure to refer to "Service note" on page 4.) not supplied not supplied FLD1 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-234-015-01 VOL KNOB RING...

  • Page 47: Main Board Section

    HCD-DX30/RG40 7-3. MAIN BOARD SECTION T911 not supplied not supplied Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 1-773-049-11 WIRE (FLAT TYPE) (17 CORE) A-4725-717-A POWER AMP BOARD, COMPLETE (DX30:KR) A-4476-795-A MAIN BOARD, COMPLETE (DX30:SP) A-4725-997-A POWER AMP BOARD, COMPLETE...

  • Page 48: Cd Mechanism Deck Section

    HCD-DX30/RG40 Ver 1.2 2003.11 7-4. CD MECHANISM DECK SECTION M721 supplied supplied not supplied supplied Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-933-134-11 SCREW (+PTPWH M2.6X8) X-4951-889-1 HOLDER (BU) ASSY 4-221-679-01 CAM (RELAY) 4-222-095-01 BELT...

  • Page 49: Electrical Parts List

    HCD-DX30/RG40 SECTION 8 ADDRESS SENSOR ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the • RESISTORS When indicating parts by reference number, parts list may be different from the parts All resistors are in ohms. please include the board name.
  • Page 50 HCD-DX30/RG40 DRIVER Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R111 1-216-121-11 RES-CHIP 1/10W A-4726-038-A KEY BOARD, COMPLETE (RG40) R113 1-216-121-11 RES-CHIP 1/10W ******************** R114 1-216-073-00 RES-CHIP 1/10W 1-681-447-11 KEY BOARD R116 1-216-001-00 METAL CHIP 1/10W...
  • Page 51 HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks S709 1-762-875-21 SWITCH, KEYBOARD(v) C110 1-162-970-11 CERAMIC CHIP 0.01uF S710 1-762-875-21 SWITCH, KEYBOARD(V) C111 1-162-970-11 CERAMIC CHIP 0.01uF S711 1-762-875-21 SWITCH, KEYBOARD(GROOVE) C112 1-162-970-11 CERAMIC CHIP 0.01uF...
  • Page 52 HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C179 1-162-970-11 CERAMIC CHIP 0.01uF C235 1-126-960-11 ELECT 20.00% 50V (RG40:AEP) C236 1-126-933-11 ELECT 100uF 20.00% 16V C180 1-162-970-11 CERAMIC CHIP 0.01uF C237 1-162-962-11 CERAMIC CHIP...
  • Page 53 HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C350 1-165-128-11 CERAMIC CHIP 0.22uF C673 1-162-953-11 CERAMIC CHIP 100PF C351 1-162-964-11 CERAMIC CHIP 0.001uF C674 1-162-953-11 CERAMIC CHIP 100PF (RG40) C675 1-126-935-11 ELECT 470uF 20.00% 10V...
  • Page 54 HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks D374 8-719-988-61 DIODE 1SS355TE-17 < FRONT END > D383 8-719-988-61 DIODE 1SS355TE-17 D601 8-719-988-61 DIODE 1SS355TE-17 FE101 1-693-496-11 FRONT END (4 GANG) (RG40:AEP) D602 8-719-988-61 DIODE 1SS355TE-17...
  • Page 55 HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks JR603 1-216-864-11 METAL CHIP 1/16W Q220 8-729-119-78 TRANSISTOR 2SC2785TP-HFE (DX30,RG40:AEP) Q221 8-729-119-78 TRANSISTOR 2SC2785TP-HFE JR606 1-216-864-11 METAL CHIP 1/16W Q222 8-729-119-78 TRANSISTOR 2SC2785TP-HFE (DX30,RG40:AEP) Q223 8-729-142-46 TRANSISTOR...
  • Page 56 HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R112 1-216-829-11 METAL CHIP 4.7K 1/16W R206 1-216-805-11 METAL CHIP 1/16W R113 1-216-829-11 METAL CHIP 4.7K 1/16W R207 1-216-832-11 METAL CHIP 8.2K 1/16W R114 1-216-829-11 METAL CHIP 4.7K...
  • Page 57 HCD-DX30/RG40 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R263 1-216-833-11 METAL CHIP 1/16W R364 1-216-821-11 METAL CHIP 1/16W R264 1-216-833-11 METAL CHIP 1/16W R365 1-216-841-11 METAL CHIP 1/16W R265 1-218-917-11 RES-CHIP 820K 1/16W R366...
  • Page 58 HCD-DX30/RG40 MAIN MOTOR Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R619 1-216-809-11 METAL CHIP 1/16W R672 1-216-841-11 METAL CHIP 1/16W R620 1-216-813-11 METAL CHIP 1/16W R673 1-216-833-11 METAL CHIP 1/16W R621 1-216-813-11 METAL CHIP 1/16W...
  • Page 59 HCD-DX30/RG40 PANEL Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks A-4476-797-A PANEL BOARD, COMPLETE C756 1-162-294-31 CERAMIC 0.001uF (DX30:AR,AUS,E,E51,MX,SP) (DX30) C757 1-162-306-11 CERAMIC 0.01uF 30.00% 16V ********************** A-4725-721-A PANEL BOARD, COMPLETE (DX30:KR) (DX30) C758 1-126-956-11 ELECT 0.1uF...
  • Page 60 HCD-DX30/RG40 PANEL Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks < FERRITE BEAD > R756 1-247-807-31 CARBON 1/4W R757 1-249-429-11 CARBON 1/4W FB701 1-412-473-41 INDUCTOR R758 1-247-807-31 CARBON 1/4W R759 1-249-429-11 CARBON 1/4W < FLUORESCENT INDICATOR >...
  • Page 61 HCD-DX30/RG40 POWER AMP Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks A-4725-717-A POWER AMP BOARD, COMPLETE (DX30:KR) C592 1-135-832-11 ELECT 2200uF (RG40) *************************** A-4725-997-A POWER AMP BOARD, COMPLETE C592 1-137-840-11 ELECT 2200uF (DX30:AR,E,E51,MX) (DX30:AR,E,E51,MX) C592 1-135-928-11 ELECT...
  • Page 62 HCD-DX30/RG40 POWER AMP SENSOR SUB TRANS Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 0 R508 1-217-156-00 METAL 0.22 1-681-442-11 SENSOR BOARD (DX30) ************* R509 1-260-076-11 CARBON 1/2W 0 R510 1-217-151-00 METAL 0.22 < THERMISTOR >...
  • Page 63 HCD-DX30/RG40 Ver 1.2 2003.11 TRANS VIDEO OUT Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 1-681-444-11 TRANS BOARD < SWITCH > ************ 0 S901 1-786-055-11 SELECTOR, VOLTAGE (DX30:AR,E,E51,SP) 1-533-217-11 HOLDER, FUSE < TRANSFORMER > < CAPACITOR >...

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