(TG-265 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
RB1
1-234-370-21 s RES, NETWORK 22 (1005X4)
RB2
1-234-370-21 s RES, NETWORK 22 (1005X4)
RB3
1-234-370-21 s RES, NETWORK 22 (1005X4)
X201
1-795-671-12 s OSCILLATOR, CRYSTAL (VCXO)3.3V
X202
1-795-670-12 s OSCILLATOR, CRYSTAL (VCXO)3.3V
1-78
------------
TX-126 BOARD
------------
Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1707-920-A s MOUNTED CIRCUIT BOARD, TX-126
C1
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C2
1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C3
1-164-862-81 s CAP, CHIP CERAMIC 33PF CH 1005
C4
1-164-862-81 s CAP, CHIP CERAMIC 33PF CH 1005
C6
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C7
1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C8
1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C9
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C10
1-164-862-81 s CAP, CHIP CERAMIC 33PF CH 1005
C11
1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C12
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C13
1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C14
1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C15
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C16
1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C17
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C18
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C19
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C20
1-100-581-81 s CAP,CHIP CERAMIC0.0047MF B1005
C21
1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C22
1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C23
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C24
1-164-934-81 s CAP, CHIP CERAMIC 330PF B 1005
C25
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C26
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C27
1-164-870-81 s CAP, CHIP CERAMIC 68PF CH 1005
C28
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C31
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C33
1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005
C34
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C35
1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C36
1-164-940-81 s CAP,CHIP CERAMIC 3300PF B 1005
C37
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C38
1-100-670-91 s CAP, CERAMIC 4.7MF C (2012)
C39
1-100-670-91 s CAP, CERAMIC 4.7MF C (2012)
C40
1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C41
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C42
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C43
1-112-021-91 s CAP, CERAMIC 2.2MF C (1608)
C44
1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C45
1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C46
1-164-934-81 s CAP, CHIP CERAMIC 330PF B 1005
C47
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C48
1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C49
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C50
1-100-581-81 s CAP,CHIP CERAMIC0.0047MF B1005
C51
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C52
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C53
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C54
1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C55
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C56
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C57
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C59
1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C61
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C62
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C64
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
HXC-100/V2 (J, E)