Table of Contents
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1 Introduction
1.1 Purpose
This Service Repair Documentation is intended to support Service partners to carry out repairs on
BenQ repair level 3 (former level 2,5light). The described failures shall only be repaired in BenQ
authorized local workshops.
The level 3 (former Level 2.5light) partners are obliged to repair level 3 classified boards, up to their
repair level, under consideration of this repair instruction.
All repairs have to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest S75 Level 1-2 repair
documentation. It has to be ensured that every repaired mobile Phone is checked according to the
latest released General Test Instruction document (both documents are available in the Technical
Support section of the C-market).
Check at least weekly C-market for updates and consider all S75 related Customer Care Information
S75
Partnumber on IMEI label:
, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
Scrap Handling: All Scrap information given in this manual are related to the
SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication
market), avoid excessive heat.
1.2 Scope
This document is the reference document for all BenQ mobile authorised Service Partners which are
released to repair BenQ mobile phones up to level 3 (2.5 light).
1.3 Terms and Abbreviations
Technical Documentation
TD_Repair_L2.5L_S75_R1.0.pdf
S30880-S7700-#xxx
Company Confidential
2005©BenQ
Release 1.0
10/2005
Page 3 of 15
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